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Simulation of a novel copper heat Sink using copper pipe and AM method for CPU group heat removing in power transformer’s cabinet
Mälardalen University, School of Sustainable Development of Society and Technology. (Process Efficiency Improvement+Energy Management & Load Control)
(Process Efficiency Improvement+Energy Management & Load Control)
2007 (English)In: Proceedings of the Electronic Packaging Technology Conference, EPTC, IEEE , 2007, p. Article number 4441469-Conference paper, Published paper (Refereed)
Abstract [en]

Heat sinks operate by conducting heat from the processor to the heat sink and then radiating it to the air. The better the transfer of heat between the two surfaces (the CPU and the heat sink metal) the better the cooling. Some processors come with heat sinks glued to them directly, ensuring a good transfer of heat between the processor and the heat sink. In this paper author have simulated a new copper heat sink and heat pipe (is a simple device that can quickly transfer heat from one point to another) that has a best heat transferring. A three Dimensional finite element is used for simulations of temperature behaviour on around of heat sink. Analytically approach is applied to determine of heat transfer coefficients. The method has a good convergence and is adaptive with other best designed heat sinks. And so we examine the use of activity migration which reduces peak junction temperature by moving computation between multiple replicated units.

Place, publisher, year, edition, pages
IEEE , 2007. p. Article number 4441469-
Keywords [en]
simulation, processor, CPU, circuit, heat sink
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Energy- and Environmental Engineering
Identifiers
URN: urn:nbn:se:mdh:diva-1250DOI: 10.1109/ICEPT.2007.4441469Scopus ID: 2-s2.0-50249135961ISBN: 9781424413928 (print)OAI: oai:DiVA.org:mdh-1250DiVA, id: diva2:37713
Conference
2007 8th International Conference on Electronic Packaging Technology, ICEPT; Shanghai; China; 14 August 2007 through 17 August 2007
Available from: 2008-10-10 Created: 2008-10-10 Last updated: 2014-05-27Bibliographically approved

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Publisher's full textScopushttp://ieeexplore.ieee.org/xpls/abs_all.jsp?isnumber=4441371&arnumber=4441469&count=210&index=97

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Mousavi Takami, KouroshMahmoudi, Jafar
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CiteExportLink to record
Permanent link

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Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf