A new design for copper base heatsink is proposed in this work. In some experimental and numerical simulation efforts, optimizing and predicting of the thermal characterization of the heatsink with inclined free fins is developed. The proposed copper heatsink has high thermal dissipation capability and lower weight and volume compare to current aluminum and copper heatsinks.
The model is scaled up in the fluent environment to predict its application in the cooling of larger heat generated electronic devices.
Free fin denotes that the fins are not integrated chemically by casting methods and also implies that the proposed heatsink consist of individual and separated fins that are assembled and holds together. Impingement air-cooling mode of force-convection is adopted for heat dissipation from high power electronic devices in associated with the proposed inclined fin model. In addition to larger surface area and airflow velocity another solution for enhancement of heat dissipation is suggested. A numerical evaluation of thermal performance of the suggested heatsink and fluid flow around the fins is performed. The thermal performance is estimated also by experimental variables. The results of experimental investigation and CFD studies are introduced in this paper. Construction method of proposed heatsink by suggested fin design is introduced. This heat sink is fabricated mechanically and is tested by a number of heat sources and high sensitive devices such as adhesive k type thermocouple, data acquisition 34970A in associated with HP Bench Link program. Components of airflow velocity in the hollow spaces of the heatsink are discussed. Pressure drop and other thermal variables are analyzed analytical and by CFD code