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Numerical modeling of two proposed mechanically fabricated free-fins heat sinks
Mälardalen University, School of Sustainable Development of Society and Technology. (PRO)
Mälardalen University, School of Sustainable Development of Society and Technology. (PRO)ORCID iD: 0000-0002-7233-6916
2009 (English)In: Proceedings of EuroSimE 2009, 2009, p. 393-404Conference paper, Published paper (Refereed)
Abstract [en]

Two new designs for copper base heat sink is proposed in this work. In some experimental and numerical simulation efforts, optimizing and predicting of the thermal characterization of the heat sink with inclined free fins is developed. A new design of the base and fins optimized both with respect to manufacture ability and performance is introduced. The proposed copper heat sinks have high thermal dissipation capability and lower weight and volume compare to current aluminum and copper heat sinks. The inclined free fins model is scaled up in the fluent environment to predict its application in the cooling of larger heat generated electronic devices. Free fin denotes that the fins are not integrated chemically by casting methods and also implies that the proposed heat sink consist of individual and separated fins that are assembled and holds together. Impingement air-cooling mode of force-convection is adopted for heat dissipation from high power electronic devices in associated with the proposed inclined fin model. The hydraulic parameters computed for square fin model include velocity profiles, distribution of static pressure, dynamic pressure, boundary layer and fluid temperature between the fins and in the passageway at the middle of the heat sink. Furthermore 3-dimensional temperature distribution through the fins and base and heat source is predicted. In addition to larger surface area and airflow velocity another solution for enhancement of heat dissipation is suggested. Numerical prediction of the thermal performance of the free fins heat sink is conducted. The thermal performance is also estimated by experimental efforts. The results of experimental investigation and CFD studies are introduced in this paper. Construction method of proposed heat sinks by suggested fin design is introduced. The free fin heat sink is fabricated mechanically and is tested by a number of heat sources and high sensitive devices such as adhesive k type thermocouple, data acquisition 34970A in associated with HP Bench Link program. Components of airflow velocity in the hollow spaces of the heat sink are discussed. Pressure drop and other thermal variables are analyzed analytically and by CFD code.

Place, publisher, year, edition, pages
2009. p. 393-404
Keywords [en]
heat transfer, CFD, heat sink, pin fin
National Category
Energy Engineering
Research subject
Energy- and Environmental Engineering
Identifiers
URN: urn:nbn:se:mdh:diva-7898DOI: 10.1109/ESIME.2009.4938506ISI: 000268178200059Scopus ID: 2-s2.0-67650562330ISBN: 978-1-4244-4159-4 (print)OAI: oai:DiVA.org:mdh-7898DiVA, id: diva2:292692
Conference
10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems Location: Tech Univ Delft, Delft, NETHERLANDS Date: APR 27-29, 2009
Available from: 2010-02-09 Created: 2010-02-09 Last updated: 2013-10-29Bibliographically approved

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Dahlquist, Erik

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