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Demo Abstract: Towards Interoperability in a Hybrid TSN/6TiSCH Network
Mälardalen University, School of Innovation, Design and Engineering, Innovation and Product Realisation.
Mälardalen University.
Mälardalen University, School of Innovation, Design and Engineering, Embedded Systems.ORCID iD: 0000-0001-5590-0784
Mälardalen University, School of Innovation, Design and Engineering, Embedded Systems.ORCID iD: 0000-0003-3469-1834
2023 (English)In: SenSys 2023 - Proceedings of the 21st ACM Conference on Embedded Networked Sensors Systems, Association for Computing Machinery, Inc , 2023, p. 500-501Conference paper, Published paper (Refereed)
Abstract [en]

There is a growing interest in increasing the flexibility and the mobility of industrial infrastructures to support novel industrial applications. To support this change, industrial networks must provide real-time guarantees while integrating a great variety of traffic over a cohesive network infrastructure. Specifically, there is special interest in the integration of wired and wireless communications in the industrial domain. We present a solution that integrates a Time-Sensitive Networking Ethernet network with a low-power 6TiSCH IoT network and discuss the implementation alternatives and their implications on delay and resource consumption. The main goal is to experimentally identify the research challenges and necessary enhancements for interoperability between constrained battery-driven wireless communication with the time sensitive wired networks.

Place, publisher, year, edition, pages
Association for Computing Machinery, Inc , 2023. p. 500-501
Keywords [en]
IEEE 802.15.4, interoperability, TSCH, TSN, IEEE Standards, Low power electronics, Titanium compounds, Cohesive networks, Ethernet networks, Ieee 802.15.4/zigbee, Industrial infrastructure, Industrial networks, Network infrastructure, Real time guarantees, Wired and wireless communications
National Category
Computer and Information Sciences
Identifiers
URN: urn:nbn:se:mdh:diva-66664DOI: 10.1145/3625687.3628415ISI: 001249418600047Scopus ID: 2-s2.0-85192731361ISBN: 9798400704147 (print)OAI: oai:DiVA.org:mdh-66664DiVA, id: diva2:1859631
Conference
21st ACM Conference on Embedded Networked Sensors Systems, SenSys 2023. Istanbul. 13 November 2023 through 15 November 2023
Available from: 2024-05-22 Created: 2024-05-22 Last updated: 2024-07-31Bibliographically approved

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Rabet, IliarFotouhi, HosseinAshjaei, Seyed Mohammad Hossein

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