Thermal-hydraulic performance of a plate heat exchanger with grooved copper foamShow others and affiliations
2023 (English)In: Case Studies in Thermal Engineering, E-ISSN 2214-157X, Vol. 51, article id 103525Article in journal (Refereed) Published
Abstract [en]
This study proposes a plate heat exchanger (PHE) partially filled with metal foam having checkered pattern grooves. The study presents new experimental data obtained from PHE with grooved copper foam that elucidates the effect of mass flux, copper foam groove width, and pore density on the heat transfer coefficient (HTC) and pressure drop (ΔP). The testing is conducted with a water mass flux ranging from 120 to 320 kg/m2s, a groove width ranging from 2 to 6 mm, and a pore density of 30 pores per inch (PPI) and 50 PPI. The results demonstrate that HTC and ΔP increase as the copper foam groove width is reduced. Considering the impact of copper foam groove width on the filling rate, the HTC ratio increases significantly at a filling rate between 50 and 75%. Furthermore, an increase in pore density enhances HTC and ΔP. The plate heat exchanger inserted with copper foam (PHE_CF) provides the optimum thermal-hydraulic performance (TP). However, at a low Reynolds number, the results show that TP of PHE with grooved copper foam with a groove width of 2 mm is similar to PHE_CF. New correlations are also proposed to predict ΔP and HTC in the practical applications.
Place, publisher, year, edition, pages
Elsevier Ltd , 2023. Vol. 51, article id 103525
Keywords [en]
Copper foam, Friction factor, Heat transfer coefficient, Nusselt number, Plate heat exchanger, Pressure drop, Copper, Drops, Heat exchangers, Heat transfer coefficients, Metal foams, Plate metal, Reynolds number, Filling rate, Foam grooves, Friction factors, Groove width, Heat transfer co-efficients, Plate heat exchangers, Pore densities, Pores per inches, Thermal-hydraulic performance
National Category
Energy Engineering
Identifiers
URN: urn:nbn:se:mdh:diva-64543DOI: 10.1016/j.csite.2023.103525ISI: 001097511000001Scopus ID: 2-s2.0-85173580917OAI: oai:DiVA.org:mdh-64543DiVA, id: diva2:1807068
2023-10-242023-10-242024-12-06Bibliographically approved