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Network Fault Tolerance by Means of Diverse Physical Layers
Mälardalen University, School of Innovation, Design and Engineering, Embedded Systems. TTTech Computertechnik AG, Vienna, Austria., Mälardalens högskola , Vasteras, Sweden.
TTTech Computertechnik AG, Vienna, Austria.
Mälardalen University, School of Innovation, Design and Engineering, Embedded Systems.ORCID iD: 0000-0001-6497-4099
2020 (English)In: IEEE International Conference on Emerging Technologies and Factory Automation, ETFA, Institute of Electrical and Electronics Engineers Inc. , 2020, p. 1697-1704Conference paper, Published paper (Refereed)
Abstract [en]

Wired networks are deployed in scenarios requiring the highest levels of performance in terms of reliability and timeliness. Unfortunately, broken wires might permanently compromise the network operation unless fault tolerance mechanisms are in place. Fault tolerance is commonly achieved by replicating the wired network components, but this paper examines the use of a wireless backup network, since the wireless physical layer (PHY) is not expected to display permanent failures due to broken wires. Two mechanisms at medium access control (MAC) level are presented to take advantage of the wireless backup network: one allocating redundancy statically and one dynamically. Without loss of generality, redundancy is applied using the standard mechanisms from IEEE 802.3 (Ethernet) and IEEE 802.11 (Wi-Fi). The performance increase added by the backup network is studied both analytically and by simulation, showing considerable improvements in a very compromised midsize wired network. © 2020 IEEE.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2020. p. 1697-1704
Keywords [en]
Factory automation, Fault tolerance, Medium access control, Physical layer, Redundancy, Broken wires, Fault tolerance mechanisms, IEEE 802.11s, IEEE 802.3, Medium access control(MAC), Network fault tolerances, Network operations, Wired networks, IEEE Standards
National Category
Computer Systems
Identifiers
URN: urn:nbn:se:mdh:diva-52180DOI: 10.1109/ETFA46521.2020.9212131ISI: 000627406500266Scopus ID: 2-s2.0-85093359661ISBN: 9781728189567 (print)OAI: oai:DiVA.org:mdh-52180DiVA, id: diva2:1484667
Conference
25th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2020, 8 September 2020 through 11 September 2020
Note

Conference code: 163774; Export Date: 29 October 2020; Conference Paper; CODEN: 85ROA

Available from: 2020-10-29 Created: 2020-10-29 Last updated: 2021-04-29Bibliographically approved

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Gutiérrez Peón, PabloUhlemann, Elisabeth

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