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ERFAN: Efficient reconfigurable fault-tolerant deflection routing algorithm for 3-D Network-on-Chip
Shahid Beheshti University, Tehran, Iran.
Shahid Beheshti University, Tehran, Iran .
University of Louisiana at Lafayette, Lafayette, United States.
Mälardalens högskola, Akademin för innovation, design och teknik, Inbyggda system. Royal Institute of Technology (KTH), Stockholm, Sweden.
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2016 (engelsk)Inngår i: International System on Chip Conference, IEEE Computer Society, 2016, s. 306-311Konferansepaper, Publicerat paper (Fagfellevurdert)
Abstract [en]

With degradation in transistors dimensions and complication of circuits, Three-Dimensional Network-on-Chip (3-D NoC) is presented as a promising solution in electronic industry. By increasing the number of system components on a chip, the probability of failure will increase. Therefore, proposing fault tolerance mechanisms is an important target in emerging technologies. In this paper, two efficient fault-tolerant routing algorithms for 3-D NoC are presented. The presented algorithms have significant improvement in performance parameters, in exchange for small area overhead. Simulation results show that even with the presence of faults, the network latency is decreased in comparison with state-of-the-art works. In addition, the network reliability is improved reasonably.

sted, utgiver, år, opplag, sider
IEEE Computer Society, 2016. s. 306-311
Emneord [en]
3-D NoC, Deflection Routing Algorithm, Fault Tolerance, Reliability, TSV, Distributed computer systems, Fault tolerant computer systems, Network architecture, Programmable logic controllers, Routers, Routing algorithms, Servers, Three dimensional integrated circuits, Deflection routings, Electronic industries, Emerging technologies, Fault tolerance mechanisms, Fault-tolerant routing algorithm, Performance parameters, Probability of failure, Three-dimensional networks, Network-on-chip
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Identifikatorer
URN: urn:nbn:se:mdh:diva-35526DOI: 10.1109/SOCC.2016.7905497ISI: 000403576000054Scopus ID: 2-s2.0-85019108151ISBN: 9781509013661 (tryckt)OAI: oai:DiVA.org:mdh-35526DiVA, id: diva2:1104478
Konferanse
29th IEEE International System on Chip Conference, SOCC 2016; Seattle; United States; 6-9 September 2016.
Tilgjengelig fra: 2017-06-01 Laget: 2017-06-01 Sist oppdatert: 2019-06-25bibliografisk kontrollert

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